TECNO Modular Phone Unveiled at MWC 2026
The TECNO Modular Phone is set to redefine smartphone design as TECNO unveils the world’s thinnest modular smartphone ecosystem concept at Mobile World Congress 2026. Powered by Modular Magnetic Interconnection Technology, this next-generation concept introduces instant hardware expansion through magnetic attachment and intelligent connectivity.
Unlike traditional smartphones limited by fixed hardware, the TECNO Modular Phone enables seamless attachment and removal of ultra-slim, high-performance modules. As a result, users can transform their device into a customizable powerhouse tailored to photography, gaming, productivity, or extended battery needs.
A Customizable Modular Smartphone Ecosystem
At the heart of the concept is a growing ecosystem of nearly ten attachable modules. These include:
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POWER BANK – Effectively doubles usable battery life while maintaining a slim profile
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ACTION CAMERA – Enables flexible shooting angles without adding bulk
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TELEPHOTO LENS – Functions as a standalone imaging system using the phone display as a live viewfinder
This modular suite allows users to carry only the components they need. Consequently, the device evolves with moment-to-moment demands, whether for creative workflows, communication, or off-grid usage.
Two distinct editions express the brand’s design philosophy:
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ATOM Edition – Silver-aluminum body with red accents, reflecting structured minimalism
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MODA Edition – A bold, geek-inspired aesthetic for expressive customization
Both interpretations position modularity as a long-term platform for personal choice rather than a one-time hardware decision.
Ultra-Thin Design Meets Intelligent Connectivity
The TECNO Modular Phone maintains remarkable slimness. The base device measures just 4.9mm thick, while the POWER BANK adds only 4.5mm. Even when combined, thickness remains comparable to standard smartphones.
The phone features a laminated anti-glare glass back and polished metal frame. Subtle structural lines divide the rear surface into modular zones, ensuring intuitive alignment without disrupting aesthetics.
Connectivity relies on a hybrid system:
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Precision magnetic array for secure attachment
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Pogo-pin connectors for efficient power transfer
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Wi-Fi, Bluetooth, and mmWave switching for high-bandwidth, low-latency data
This architecture allows automatic pairing and seamless interaction. Therefore, users experience expansion without technical complexity.
Building a Future-Ready Modular Platform
Designed as a scalable platform, the TECNO Modular Phone lays the groundwork for future AI-powered tools, storage expansion modules, and lifestyle accessories. Although proprietary, the ecosystem hints at potential broader compatibility in the future.
By presenting this concept at Mobile World Congress 2026, TECNO signals its long-term vision for adaptive, user-defined hardware. Instead of being locked into factory specifications, smartphones may soon evolve dynamically with user intent.
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