Ormco™ Corporation, a global leader in orthodontic solutions for over 60 years, is thrilled to announce the modernization of the commonplace adhesive and bonding process with the introduction of Ormco™ EtchFree Bonding. With minimal bonding modification developments in over 100 years of orthodontics, the launch of EtchFree is a breakthrough bonding solution to reform and improve clinical efficiency and helps maintain tooth enamel health.
“In the bonding process, most doctors don’t consider the drawbacks of typical acid etching where the tooth’s surface is roughened, and the enamel can be damaged. I can see the visible difference just by looking at it and not seeing the damage traditional bonding may create. There are also risks of patient discomfort, sensitivity in debonding, bond reliability, and the most prominent pain point for most orthodontists is making sure the etching and rinsing are done thoroughly to avoid technique sensitivity,” said Dr. Jennifer Messenger.1 “I’m ecstatic because there has not been a new innovation in bonding until now. My practice has also increased efficiency because patients are not having to make as many return appointments in the first few weeks after the start of treatment, due to brackets popping off.”
Ormco EtchFree Bonding eliminates acid etching, allowing for:
- Easier and Faster Procedures – No etching, rinsing, drying, or waiting. No special steps, brush and go.
- Fewer Debonds – Consistent bonds in wet or dry fields. Tolerates moisture in every bonding step.
- Improved Patient Experience – Helps preserve enamel health. No risk of burning or discomfort. Helps prevent white spot lesions (WSLs).
How it works:
- Etch Based Bonding – Resin infiltrates the etched surface and is cured to create a mechanical bond.
- Ormco EtchFree Technology – Ionic bonds are formed directly with the calcium found in enamel without damaging the tooth surface.
Ormco EtchFree Bonding exhibits consistent bond strength under dry or wet conditions (vs. tested products). Etchfree Bonding has fewer debonds caused by moisture contamination, leading to a better patient and doctor experience. The traditional etch, prime, and bond procedure takes eleven steps vs only nine steps with EtchFree Bonding, making procedures faster and easier. By eliminating the steps that involve additional waiting, careful rinsing, drying, and technique sensitivities, clinical efficiency is greatly improved for customers.
“With the astounding technological advancements in orthodontics, it’s surprising there has been limited improvement to the standard bonding mode. Ormco responded to the industry demand for a better system because a product that performs well in wet or dry conditions reduces pain points for orthodontic professionals. Not only does EtchFree increase bond reliability, there is increased comfort for the patient and it assists in preserving enamel health,” said Jay Issa, Vice President Portfolio Management, Ormco.
The Ormco EtchFree Bonding system consists of three products and needs no special steps or equipment. The official launch will occur at AAO (American Association of Orthodontists) in Philadelphia, PA, April 25-27, 2025 (Booth #1015).
